Product Specification Parameters
| Product Model |
Product Name |
Color |
Typical
Viscosity (cps) |
Curing Time |
Use |
Distinction |
| DM-6513 |
Epoxy underfill bonding adhesive |
Opaque Creamy Yellow |
3000~6000 |
@ 100℃
30min
120℃ 15min
150℃ 10min |
Reusable CSP (FBGA) or BGA filler |
One-component epoxy resin adhesive is a reusable filled resin CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA. |
| DM-6517 |
Epoxy bottom filler |
Black |
2000~4500 |
@ 120℃ 5min 100℃ 10min |
CSP (FBGA) or BGA filled |
One-part, thermosetting epoxy resin is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stresses in handheld electronics. |
| DM-6593 |
Epoxy underfill bonding adhesive |
Black |
3500~7000 |
@ 150℃ 5min 165℃ 3min |
Capillary Flow Filled Chip Size Packaging |
Fast curing、 fast flowing liquid epoxy resin, designed for capillary flow filling chip size packaging. It is designed for process speed as a key issue in production. Its rheological design allows it to penetrate the 25μm gap, minimize induced stress, improve temperature cycling performance, and have excellent chemical resistance. |
| DM-6808 |
Epoxy underfill adhesive |
Black |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) or BGA bottom fill |
Classic underfill adhesive with ultra-low viscosity for most underfill applications. |
| DM-6810 |
Reworkable epoxy underfill adhesive |
Black |
394 |
@130℃ 8min |
Reusable CSP (FBGA) or BGA bottom
filler |
The reusable epoxy primer is designed for CSP and BGA applications. It cures quickly at moderate temperatures to reduce stress on other components. Once cured, the material has excellent mechanical properties to protect solder joints during thermal cycling. |
| DM-6820 |
Reworkable epoxy underfill adhesive |
Black |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
Reusable CSP (FBGA) or BGA bottom
filler |
The reusable underfill is specifically designed for CSP, WLCSP and BGA applications. It is formulated to cure rapidly at moderate temperatures to reduce stress on other components. The material has a high glass transition temperature and high fracture toughness for good protection of solder joints during thermal cycling. |
Product Features
| Reusable |
Rapid curing at moderate temperatures |
| Higher glass transition temperature and higher fracture toughness |
Ultra-low viscosity for most underfill applications |
Product Advantages
It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. It cures quickly as soon as it is heated. It is designed to provide good protection against failure due to mechanical stress. Low viscosity allows gaps to be filled under CSP or BGA.
