Epoxy underfill chip level adhesive

Category:

Product Specification Parameters

Product Model Product Name Color Typical

Viscosity (cps)

Curing Time Use Distinction
DM-6513 Epoxy underfill bonding adhesive Opaque Creamy Yellow 3000~6000 @ 100℃

30min

120℃ 15min

150℃ 10min

Reusable CSP (FBGA) or BGA filler One-component epoxy resin adhesive is a reusable filled resin CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
DM-6517 Epoxy bottom filler Black 2000~4500 @ 120℃ 5min 100℃ 10min CSP (FBGA) or BGA filled One-part, thermosetting epoxy resin is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stresses in handheld electronics.
DM-6593 Epoxy underfill bonding adhesive Black 3500~7000 @ 150℃ 5min 165℃ 3min Capillary Flow Filled Chip Size Packaging Fast curing、 fast flowing liquid epoxy resin, designed for capillary flow filling chip size packaging. It is designed for process speed as a key issue in production. Its rheological design allows it to penetrate the 25μm gap, minimize induced stress, improve temperature cycling performance, and have excellent chemical resistance.
DM-6808 Epoxy underfill adhesive Black 360 @130℃ 8min 150℃ 5min CSP (FBGA) or BGA bottom fill Classic underfill adhesive with ultra-low viscosity for most underfill applications.
DM-6810 Reworkable epoxy underfill adhesive Black 394 @130℃ 8min Reusable CSP (FBGA) or BGA bottom

filler

The reusable epoxy primer is designed for CSP and BGA applications. It cures quickly at moderate temperatures to reduce stress on other components. Once cured, the material has excellent mechanical properties to protect solder joints during thermal cycling.
DM-6820 Reworkable epoxy underfill adhesive Black 340 @130℃ 10min 150℃ 5min 160℃ 3min Reusable CSP (FBGA) or BGA bottom

filler

The reusable underfill is specifically designed for CSP, WLCSP and BGA applications. It is formulated to cure rapidly at moderate temperatures to reduce stress on other components. The material has a high glass transition temperature and high fracture toughness for good protection of solder joints during thermal cycling.

 

Product Features

Reusable Rapid curing at moderate temperatures
Higher glass transition temperature and higher fracture toughness Ultra-low viscosity for most underfill applications

 

Product Advantages

It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. It cures quickly as soon as it is heated. It is designed to provide good protection against failure due to mechanical stress. Low viscosity allows gaps to be filled under CSP or BGA.