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Phone: +86-133 5263 6504
Analysis of the Improvement of the Seismic and Impact Resistance Performance of PCB by Encapsulation During the operation of electronic devices, the PCB (Printed Circuit Board), as the support for electronic components and the provider of electrical connections, plays a…
A Comprehensive Guide to Evaluating the Reliability of Encapsulation Materials for Encapsulated PCBs In modern electronic devices, the printed circuit board (PCB) plays a central role, and the encapsulation technology is a key means to ensure the long-term stable operation…
In-depth Analysis of the Reparability of Encapsulation Materials Encapsulation materials are widely used in modern industry. Their function is to protect internal electronic components, mechanical parts, etc., from external environments such as moisture, dust, chemical substances, and mechanical stress, thereby…
A Comprehensive Analysis of Post-Potting PCB Issues and the Repair and Rework of Potting Materials In the field of electronic manufacturing, PCB (Printed Circuit Board) potting is a crucial process. It can provide protection for electronic components, shielding them from…
A Comprehensive Analysis of the Compatibility between Encapsulation Materials and PCBs: Exploration of Chemical Reactions and Their Impact on Performance In the field of electronic device manufacturing, the use of encapsulation materials is crucial for protecting the electronic components on…
How to Ensure the Compatibility between Encapsulation Materials and Various Components on PCBs In electronic devices, the printed circuit board (PCB) carries various components, and the stability of its performance is crucial for the overall operation of the device.…
A Comprehensive Analysis of Curing Problems of Encapsulating Materials and Their Solutions In numerous industrial fields such as electronics and machinery, encapsulating materials are widely applied. They play a crucial role in providing functions like waterproofing, moisture-proofing, insulation, and protection…
Determination of Curing Parameters of Encapsulating Materials: From Theory to Practice In numerous fields such as electronics manufacturing, aerospace, and automotive, encapsulating materials are widely used to protect electronic components, enhance structural stability, and achieve functions like waterproofing, moisture resistance,…
How to Determine the Appropriate Encapsulation Thickness In numerous fields such as electronic packaging, mechanical manufacturing, and building waterproofing, the encapsulation technology plays a crucial role. It can provide various functions for the encapsulated objects, including waterproofing, moisture resistance, insulation,…
Influence of Encapsulation Thickness on the Heat Dissipation Performance and Electrical Insulation Performance of PCB In the design and manufacturing of electronic devices, the performance of the printed circuit board (PCB) is of vital importance. Encapsulation, as an important…
Causes and Avoidance Methods of Bubble Generation in the Potting Process In many fields such as electronic manufacturing, the potting process is an important link for protecting electronic components, enhancing product stability and reliability. If bubbles are generated during…
Technical Details on Controlling Parameters such as Temperature, Pressure, and Speed in the Potting Process to Ensure Potting Quality Potting, as a crucial process in industrial production, is widely applied in numerous fields such as electronics, pharmaceuticals, and automobiles.…