Potting and Encapsulation
Potting is, very simply, the process of covering a component with a resin to guard against potential environmental threats. The most common use for potting is to protect against water and moisture, or to insulate electrically. However, potting can also protect PCBS and other components from thermal and physical shock, chemical attack and tampering, as well as be a physical and visual shield to protect intellectual property and consumer information.
Epoxy encapsulants are used for encapsulating, potting, and sealing components, and usually provide strong and reliable bonds with excellent moisture and chemical resistance and low shrinkage. Versatile epoxies can be used in a wide variety of applications such as glob top encapsulants for delicate chip components, underfill encapsulants to minimize thermal stress, potting compounds for transformers, and more.